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Data S5 (Fig. S2)

online resource
posted on 19.11.2019 by Ronan Hinchet, Hong-Joon Yoon, Hanjun Ryu, Moo-Kang Kim, Eue-Keun Choi, Dong-Sun Kim, Sang-Woo Kim
Photo image of the cross-sectional VI-TEG characterized by FE-SEM, demonstrating the air gap between perfluoroalkoxy (PFA) and bottom Printed Circuit Board (PCB).

History

dc.type.embargo

custom

dc.format.extent

93380

dc.date.embargoedUntil

2020-08-02

dc.identifier.uri

http://hdl.handle.net/10255/dryad.221423

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